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20250325_SMII_Laporan Informasi dan Fakta Material_31870990_lamp1.pdf

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Nomor / Number: S- 217/SMI/DU/0325                        24 Maret 2025 / March 24, 2025


Kepada Yth./To:
Bapak Iman Rachman
Direktur Utama / President Director
PT Bursa Efek Indonesia / Indonesia Stock Exchange
Indonesia Stock Exchange Building, Tower I
Jl. Jend. Sudirman Kav. 52-53
Jakarta 12190


Perihal / Re:   Kesiapan Pembayaran Sukuk Mudharabah Berkelanjutan III Sarana
                Multi Infrastruktur Tahap I Tahun 2024 Seri A dan Obligasi
                Berkelanjutan IV Sarana Multi Infrastruktur Tahap I Tahun 2024
                Seri A

                Readiness for Principal Settlement of Tranche I Shelf Registration Sukuk
                Mudharabah IV Sarana Multi Infrastruktur Year 2024 Series A and
                Tranche I Shelf Registration Bond IV Sarana Multi Infrastruktur Year
                2024

Dengan hormat / Dear sir,

Merujuk pada Peraturan PT Bursa Efek Indonesia Nomor I.A.3 mengenai Kewajiban Pelaporan
Emiten pasal 9, melalui surat ini kami menyatakan kesiapan dana pembayaran untuk pelunasan
pokok surat utang sebagai berikut:
    Sukuk Mudharabah Berkelanjutan III Sarana Multi Infrastruktur Tahap I Tahun 2024
       Seri A sebesar Rp63.555.000.000 (enam puluh tiga miliar lima ratus lima puluh lima
       juta Rupiah), yang akan jatuh tempo pada 15 Juli 2025.
    Obligasi Berkelanjutan IV Sarana Multi Infrastruktur Tahap I Tahun 2024 Seri A
       sebesar Rp78.685.000.000 (tujuh puluh delapan miliar enam ratus delapan puluh lima
       juta Rupiah), yang akan jatuh tempo pada 15 Juli 2025.

With reference to Indonesia Stock Exchange regulation No. I.A.3 regarding Issuer Reporting
Obligation Article 9, we hereby to declare our readiness for principal settlement of:
    Tranche I Shelf Registration Sukuk Mudharabah IV Sarana Multi Infrastruktur Year
       2024 Series A amounted Rp63,555,000,000 (sixty tree billion five hundred fifty five
       million Rupiah), which will mature on July 15, 2025.
    Tranche I Shelf Registration Bonds IV Sarana Multi Infrastruktur Year 2024 Series A
       amounted Rp78.685.000.000 (seventy eight billion six hundred eighty five million
       Rupiah), which will mature on July 15, 2025.
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Demikian kami sampaikan, atas perhatiannya kami ucapkan terima kasih.

Thank you for your kind attention and cooperation.


PT SARANA MULTI INFRASTRUKTUR (PERSERO)
    Signed by REYNALDI HERMANSJAH
    (XY0723)
    Signed at Mar 24, 2025 22:30:15




Reynaldi Hermansjah
Presiden Direktur / President Director


Tembusan Yth. / cc:
Bapak Ditto Pramudya, Vice President – Capital Market Service Department
PT Bank Mandiri (Persero) Tbk.- Trustee


“Keterangan : Dokumen ini ditandatangani secara elektronik” / Note: This document is electronically
signed

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Published25 Mar 2025
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Names mentioned 8 people and organisations named in the text · linked when the evidence is strong

linked org Sarana Multi Infrastruktur p.1 ×9
linked person REYNALDI HERMANSJAH p.2 ×2
linked org Bank Mandiri (Persero) Tbk. p.2 ×2
possible org PT Bursa Efek Indonesia p.1 ×2
unresolved person Iman Rachman p.1
unresolved org Indonesia Stock Exchange p.1 ×3
unresolved org PT Bursa Efek Indonesia Nomor I.A. p.1
unresolved person Ditto Pramudya p.2

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